BZ-26 Reballing Stencil

✅ Multifunctional Reballing Stencil – Designed for universal use with a wide range of BGA/IC chip sizes and types.

✅ Supports Multiple Pitch Sizes – Compatible with 0.3mm, 0.35mm, 0.4mm, and 0.5mm ball sizes for maximum flexibility.

✅ High-Quality Material – Made from 0.12mm thick Japanese steel, ensuring excellent durability, flatness, and reusability.

✅ Anti-Glare Black Coating – Matte black finish minimizes reflection for precise alignment and easy solder paste application.

✅ Precise Laser-Cut Holes – Clean, accurate square holes with rounded corners help form perfect solder balls.

✅ Wide Compatibility – Suitable for reballing CPU, GPU, NAND, RAM, and mobile ICs, including Apple, Android, and other brands.

✅ Ideal for Professionals – Recommended for skilled technicians involved in motherboard or logic board chip-level repair.

✅ Compact & Portable Design – Lightweight and easy to carry, perfect for repair shops, training centers, and DIY use.